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Micron 20

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Surface Finishing

  • Infra-red dipping – track and pads are covered by Sn/Pb
  • Hot air leveling (HAL) – only uncovering by soldermask areas are covered with Sn/Pb - 0.0005~0.035mm (20 micro in. ~ 1400 micro in.)
  •   Lead-free hot air leveling – 2~50microns
  • Passivation (OSP – organical film for protection of copper) – 0,03~0,05microns
  • Galvanic Nickel/Gold over edge connectors – Nickel  ~5microns, Gold ~1micron